| 摘要 |
<p>PURPOSE:The titled composition, containing an epoxy resin, polyvinyl butyral- modified novolak type phenolic resin and a specific amount of an inorganic filler and having improved moisture resistance and heating and cooling cycle properties, low stress and good molding operability. CONSTITUTION:A composition containing (A) an epoxy resin (a compound having at least two epoxy groups in the molecule), (B) a polyvinyl butyral- modified novolak type phenolic resin, preferably obtained by reacting polyvinyl butyral resin with a phenol, aldehyde, etc., and having 10-50wt% polyvinyl butyral modification ratio and (C) an inorganic filler. The content of the component (C) is 25-90wt% based on the resin composition.</p> |
