| 发明名称 |
Device having a semiconductor component mounted on a substrate |
| 摘要 |
A semiconductor component (8) is proposed which is provided with a projection (9) which engages in a recess (10) in a substrate (4) on which the semiconductor component is mounted. This achieves a precise alignment of the semiconductor component with respect to the substrate. <IMAGE> |
| 申请公布号 |
DE3635154(A1) |
申请公布日期 |
1987.04.23 |
| 申请号 |
DE19863635154 |
申请日期 |
1986.10.13 |
| 申请人 |
MITSUBISHI DENKI K.K. |
发明人 |
HIROKAWA,MASAYUKI |
| 分类号 |
H01L23/28;H01L23/31;H05K3/30;(IPC1-7):H01L23/32;H05K1/18;H05K7/06;H01L23/02 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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