| 摘要 |
<p>PURPOSE:To reduce the number of any defective products while preventing the crack 4 or the like due to mechanical stress such as dicing in case of cutting and separating pellets from a wafer from reaching the element functional part by means of providing the peripheral part of a pellet with grooves. CONSTITUTION:An element functional part 2 directly related to the operation of elements such as a junction, mesa groove for protecting P-N junction or improving the dielectric strength, as well as a depletion region expanding in operation and the like is situated in the central part of a semiconductor pellet (substrate) 1 while a groove 3 encircling the functional part 2 is provided in the space between the part 2 and the peripheral parts of pellet 1. AT this time, it is recommended to form the groove 3 around 1.5 times deeper compared with the depth of P-N junction of element functional part 2 by a process such as etching or the like under no effect of mechanical stress.</p> |
