发明名称 COMPOSIZIONE E PROCESSO PER IL RIVESTIMENTO PROTETTIVO DI COMPONENTI ELETTRONICI
摘要 1. Method of making a seal coating consisting of an aromatic polymer curable into a polyimide, on electronic circuits, characterized in that onto the circuits a coating material with a content of aromatic polymer, an organic solvent therefor, and a non-ionic fluorocarbon surfactant is applied, and cured into a sealing polyimide coating.
申请公布号 IT1165111(B) 申请公布日期 1987.04.22
申请号 IT19790023826 申请日期 1979.06.25
申请人 INTERNATIONAL BUSINESS MACHINES CORP 发明人
分类号 H01L21/312;H01L21/56;H01L23/29;H01L23/31;H05K3/28 主分类号 H01L21/312
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