| 摘要 |
<p>PURPOSE:To improve economy and productivity of multilayer interconnection substrate, by connecting inner-wiring connecting pads to a wiring set through the inside of the multilayer interconnection substrate. CONSTITUTION:Input/output-pin connecting pads 4 are linked to inner-wiring connecting pads 8. These pads are formed in a wiring pattern, which can be cut and divided electrically with laser light beams and the like. A signal-wiring connecting through hole 3 is taken out of each inner-wiring connecting pad 8 in a ceramic substrate 1. An input/output-terminal-connection changing pad 10 is provided on the first main surface, on which electric parts are mounted. A through hole 9, which is connected to each input/output-pin connecting pad 4, is connected to said pad 10. When the wiring is to be changed or when other technological change is to be carried out, the intermediate connecting part between the input/output-pin connecting pad 4 and the inner-wiring connecting pad 8 is cut with laser. An input/output pin 5 is cut from the inner- wiring connecting through hole. Then, a discrete line 11 is connected to the input/output-terminal-connection changing pad 10 with solder.</p> |
