| 摘要 |
PURPOSE:To obtain a coil of the upper layer and the lower layer by breaking off the substrate surface and the pattern surface, by sticking an insulating layer to the substrate surface, when forming a multi-layer coil of a thin film head, and providing a photoresist pattern whose section for supporting the upper layer coil is an inverted trapezoid or mushroom type, on said insulating layer. CONSTITUTION:An insulating layer 3a is stuck onto a substrate 1, and on this layer, an upper layer coil supporting resist pattern 4a whose section is an inverted trapezoid or mushroom type is formed. Subsequently, a conductive layer 5 for plating is stuck to the whole surface by sputtering, and the surfaces of the insulating layer 3a and the pattern 4a are broken off, respectively. Thereafter, on these conductive layers 5 which have been broken off, a plating layer 6 is formed. In this way, even if the layer 6 has spread at the time of plating, the upper layer coil and the lower layer coil are not short-circuited, and also the coil forming process is reduced remarkably. |
