| 摘要 |
PURPOSE:To enable the bonding condition to be alleviated by providing a supersonic loading mechanism for loading supersonic waves on a semiconductor mounting base. CONSTITUTION:A supersonic oscillator 50 which oscillates by the magnetostrictive action is fixed to the lower plate 35 of a semiconductor mounting base 30. A conical supersonic horn 51 extends from the supersonic oscillator 50 and is fixed to the upper plate 34. When a semiconductor and a substrate are bonded, a semiconductor 40 is heated by the heating of a heat block 33, and the aligning of the semiconductor 40 with a bonding tool 60 and the aligning with the substrate are performed by moving a base 20. At the time of bonding, the heated bonding tool 60 presses the substrate and the semiconductor 40 to perform the bonding, and at this time, the supersonic oscillator 50 oscillates, and the oscillator is amplified by the supersonic horn 51, by which supersonic waves are transmitted to the semiconductor mounting base 30. And this supersonic oscillation is transmitted to the semiconductor 40 without being attenuated due to the action of leaf springs 36. |
