发明名称 Stamped circuitry assembly
摘要 Disclosed is a printed circuit board assembly including an integral metal stamping having a plurality of conductive circuit paths received in complementarily-shaped recesses of a dielectric substrate. The integral metallic stamping includes an improved snap action switch having an improved actuator mechanism, an improved rotary switch of the type making on/off contact during rotation thereof, and an upstanding plug-like connector member receivable in a mating female connector. Each of the switches mentioned above as well as the plug-like connector can be formed separately in different printed circuit board assemblies.
申请公布号 US4659157(A) 申请公布日期 1987.04.21
申请号 US19850771858 申请日期 1985.09.03
申请人 MOLEX INCORPORATED 发明人 NIGG, DANIEL;DEROSS, ROBERT;SOMMER, EDWARD;RAYMER, II, JACK D.;CRANE, BURKE
分类号 H01H19/00;H01H1/48;H01H1/58;H01H5/18;H01H19/58;H01H21/44;H01H43/10;H05K3/20;(IPC1-7):H01R29/00 主分类号 H01H19/00
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