| 摘要 |
PURPOSE:To improve workability by a method wherein a semiconductor chip, wiring pattern, and other circuit elements are sealed with glass cloth semi- hardened by impregnation of resin and a planar molding. CONSTITUTION:A prepreg frame 11 is built of glass cloth heated and dried after being applied or impregnated with a solution in which an epoxy resin (molecular weight approximately 300-2,000), a hardening agent (dicyandiamide, etc.), and a catalytic substance (3rd-grade amine, imidazoles, etc.) are diluted in a solvent (dimethyformamide, methyl ethyl ketone, methyl cellosolve, etc.). A polymer layer is formed on one side of a planar metal plate 12. The prepreg frame 11 constitutes the side walls of a capping section and is bonded to a substrate 1 and to the polymer-coated metal plate 12. Elimination of the steric processing of a molding and of surfaces whereto the molding is to be bonded facilitates the manufacturing work, eliminates the need of an adhesive agent, reduces the space required, and accomplish miniaturization. |
