METHOD FOR INSPECTING INTEGRATED CIRCUIT CHIPS

摘要

Integrated circuit chips (1), mounted by solder mounds (3) to a substrate carrier (2), can be elastically deformed by impact forces during manual or tool handling by plastic creep of the solder mounds. In order to detect the deformation of the chips and accordingly the integrity of the chips as well as that of the solder mounds, they are inspected by reflecting an illuminated grid (22) from a (mirror polished) backside of the chips, and viewing the reflected image (23) for distortion of the grid lines (24, 25).