| 摘要 |
PURPOSE:To prevent deterioration in characteristics, to omit necessity of collecting electrode pads only at the peripheral part of a chip and to reduce the area of the chip, by providing a bridging part, which links facing side walls as a unitary body, and providing film wirings for connecting electrode pads, which are provided in the vicinity of the center of the integrated circuit chip on the bridging part, by using metal wires. CONSTITUTION:On an integrated circuit chip 4, electrode pads 6 are provided not only at the peripheral part but also in the vicinity of the center of the chip. A bridging part 7 is provided so as to link facing side walls 2 at both sides. Film wirings 8 on the bridging part 7 and the electrode pads 6 in the vicinity of the center of the chip are connected with short metal wires. Mounting of the chip 4 and the connection of the metal wires are performed as follows: at first, the integrated circuit chip 4 is placed under the bridging part 7 of a case substrate 1 and mounted on the case substrate; and the connection with electrode pads 5 on the integrated circuit chip is performed with metal wires 9. The electrode pads 6 in the vicinity of the center of the chip and the film wirings 8 on the bridging part 7 are connected with metal wires. |
