Formation of laminated structures by selective dielectric heating of bonding film.

摘要

Multiple materials are bonded together by means of an RF-sensitized bonding film or sheet, wherein the RF-sensitized bonding film or sheet is inserted at an intermediate position adjacent to the multiple materials to be bonded, and exposed to a dielectric field for such period of time so as to effect fusion or sintering of the RF-sensitized bonding film or sheet to the multiple materials so as to bond the multiple materials together and form a laminated structure.