| 发明名称 |
CIRCUIT SUBSTRATE HAVING HIGH THERMAL CONDUCTIVITY |
| 摘要 |
A high thermal conductivity circuit substrate is provided comprising a sintered aluminum nitride ceramic substrate consisting essentially of one member selected from the group of yttrium, the rare earth metals and the alkali earth metals and an electrically conductive thick film paste for a conductive layer formed on the substrate. |
| 申请公布号 |
EP0153737(A3) |
申请公布日期 |
1987.04.15 |
| 申请号 |
EP19850102159 |
申请日期 |
1985.02.27 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
IWASE, NOBUO;ANZAI, KAZUO;SHINOZAKI, KAZUO;TSUGE, AKIHIKO;SAITO, KAZUTAKA;RIYOGI, KIYOSHI;SATO, NOBORU;KASORI, MITSUO |
| 分类号 |
C04B41/51;C04B41/52;C04B41/88;C04B41/89;H01L23/15;H01L23/373;H05K1/03;(IPC1-7):H01L23/14;H01L23/36 |
主分类号 |
C04B41/51 |
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