| 摘要 |
PURPOSE:To perform bonding without processing of a semiconductor element and to manufacture a film carrier, by forming protruded parts at the tip parts of a plurality of leads, which are extended and formed to the opening parts of a flexible insulating film by a heating means. CONSTITUTION:A metal foil 4 is laminated so as to avoid sprocket holes 2 on a flexible insulating film 1. Thereafter heating is performed and a bonding agent 3 is hardened. As the metal foil 4, e.g., copper, copper alloy such as Be-Cu and the like are used. Then, the metal foil 4 is machined through a photolithography process and an etching process. Thus fingers 5 are formed. Then, layer light is projected on the tip part of each finger 5. After the melting point is reached at the tip part of the finger 5, on which the laser light is projected, a small ball is formed at the tip due to surface tension. The ball is gradually cooled. Thus a downward dropping shape is obtained, and a semispherical shape, a tear drop shape and the like are formed. A film carrier has the fingers 5 having the protruded parts 6, which are formed in this way. Tin or nickel is plated as a basis, and gold is plated thereon. Thus the film carrier with bumps is formed. |
