| 摘要 |
<p>PURPOSE:To cool the respective package constituting a semiconductor device with extreme efficiency by disposing a cooling fin having a plurality of wings in the package of a semiconductor (chip) device having a large heat release amount, and simultaneously disposing a cooling fin between the wings of the cooling fin, thereby obtaining a highly efficient cooling apparatus. CONSTITUTION:The semiconductor device is composed by causing a cooling apparatus c to be adhered to the reverse side of the base 1a of a package consisting of aluminium nitride ceramics by means of an adhesive q composed of an epoxy resin, said cooling apparatus c consisting of a cooling fin 2 which has a comb-shaped cross section and is provided with four static wing f consisting of an aluminium plate-like body disposed with a predetermined spacing therebetween and in parallel with each other, and a cooling fin 3 disposed between static wings f. This fin 3 is provided with a brass dynamic wing 3c which is driven by a piezoelectric element 3b, and the heat is dissipated by applying a voltage of an appropriate frequency from a power supply line 3d to the piezoelectric element 3b (bimorph) so as to cause it to oscillate, which piezoelectric element is formed by stacking two piezoelectric bodies composed of lead titanate + lead zirconate + (alpha).</p> |
