发明名称 LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAID LEAD FRAME
摘要 PURPOSE:To ensure bonding and to prevent short circuits of wires, by the structure of a lead frame, which is formed so that the width of an inner lead that is provided at the neighborhood of a tab suspending lead is larger than other inner leads. CONSTITUTION:A lead frame 1 has a square frame part 2, a plurality of leads, which are extended to the central direction from each side of the frame part 2, and tie bars 4, which connect the intermediate parts of the leads. At the central part of the lead frame 1, a square tab 5 is formed. The tab 5 is supported with suspending leads 6, which link the four corners of the tab 5 and the four corners of the frame part 2. Each part of the lead 3 surrounded by the tie bar 4 forms an inner lead 7. The surface of at least tip part of the inner lead 7 is plated with a gold layer and the like for excellent bonding. The width of an inner lead 7a neighboring the tab suspending lead is made broader than the width of other inner lead 7.
申请公布号 JPS6281738(A) 申请公布日期 1987.04.15
申请号 JP19850221832 申请日期 1985.10.07
申请人 HITACHI MICRO COMPUT ENG LTD;HITACHI LTD 发明人 HAGIWARA YASUHISA;MASUDA MASACHIKA
分类号 H01L23/50;H01L21/48;H01L23/495 主分类号 H01L23/50
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