发明名称 LEAD-FRAME FEEDING APPARATUS FOR SEMICONDUCTOR MOUNTING APPARATUS
摘要 PURPOSE:To improve the availability of an apparatus without stopping the apparatus, by operating an electromagnet and a lead-frame discarding cylinder when a sucking chuck sucks two or more lead frames, discarding the lead frames in a lead-frame discarding box, and sucking the next lead frame. CONSTITUTION:Many lead frames 1 are stacked vertically and accommodated in lead-frame container part 13. A sucking chuck 4 of a sucking part 14 has an electromagnet 3. A lead frame 1a at the topmost part is sucked with vacuum based on the up and down movement and back and forth movement of cylinders 5 and 6. The lead frames are moved to a position for detecting pick-up of two lead frames. When pick-up of two frames is detected, the electromagnet 3 in the sucking chuck 4 is operated, and the two or more lead frames are held. The sucking chuck 4 is moved on a lead-frame discarding box 11 by a discarding cylinder 10 of a lead-frame discarding and driving part 17 at the forward part. The power source for the electromagnetic 3 is turned OFF. The two or more lead frames are discarded in the lead frame discarding box 11. Then, the topmost lead frame 1a in the lead-frame container part is adsorbed with vacuum.
申请公布号 JPS6281740(A) 申请公布日期 1987.04.15
申请号 JP19850222948 申请日期 1985.10.07
申请人 NEC CORP 发明人 TAKANO HIDEAKI
分类号 H01L23/50;H01L23/48 主分类号 H01L23/50
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