| 摘要 |
A semiconductor integrated circuit device which includes input and output buffers having a high versatility of design is disclosed. Each buffer provided in correspondence with a bonding pad is made usable for either the input buffer or the output buffer in accordance with a wiring pattern to be formed therein. With this arrangement, it is possible to use the same circuit elements for both the input buffer and the output buffer. Thus, circuit elements to be exclusively used for inputting and outputting respectively need not be separately formed, and the area occupied by the buffers is reduced to that extent, to realize an increase in the number of pins or a reduction in the size of a chip. In addition, since one buffer can be set for either inputting or outputting, enhancement in the versatility of the design of the pins or the chip is achieved. |
