发明名称 SINGLE VAPOR SYSTEM FOR SOLDERING, FUSING OR BRAZING
摘要 <p>A single vapor system for soldering, fusing, or brazing includes vertically disposed chambers which provide a draining and drying zone above a vapor processing zone. Draining occurs in the upper zone with no additional heat being added in vapor recovery. A sealing system is utilized which is actuated by the carrier elevator as an article-carrying basket is moved into and out of the zones. The sealing system includes a moveable top cover resting on the top of the article-carrying basket, with the top cover being left at the top of the draining and drying zone to seal the top of this zone when the basket is lowered to the bottom of this zone. A moveable bottom plate is raised by pulleys and weights, spring returns or other means to the bottom of the draining and drying zone such that the bottom plate seals the bottom of this zone, isolating the zones one from the other. Liquid drained from the article in the upper zone flows into a peripheral channel at the bottom plate to provide a liquid seal around the perimeter of the bottom plate. An unheated primary vapor recovery system and a combined system vent and unheated secondary recovery system are utilized far the draining and drying zone. In one embodiment, the carrier elevator includes basket-lowering straps or tapes which pass through cylindrical or square channels carried by the top plate, with the channels carrying slit and chamfered discs for prevention of vapor leakage at the points where the tapes pass through the top plate. In a completely automated embodiment, the carrier elevator is provided with an endless horizontal belt, with the belt being driven only when the carries reaches the load/unload position.</p>
申请公布号 CA1220382(A) 申请公布日期 1987.04.14
申请号 CA19830438456 申请日期 1983.10.05
申请人 HTC CORPORATION (THE) 发明人 PECK, DOUGLAS J.;SPIGARELLI, DONALD J.
分类号 B23K1/015;H01L21/00;(IPC1-7):B23K1/00 主分类号 B23K1/015
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