发明名称 Compliant layer printed circuit board
摘要 A printed circuit board having a compliant layer sandwiched between a pattern of conductors and an insulating layer. The printed circuit board has leadless chip carriers attached to soldering pads on the board using conventional soldering techniques. The elasticity of the compliant layer between the pattern of conductors and the insulating layer provides mechanical decoupling for minimizing stresses on the solder joints due to the different thermal coefficients of expansion of contiguous materials.
申请公布号 US4658332(A) 申请公布日期 1987.04.14
申请号 US19850777869 申请日期 1985.09.19
申请人 RAYTHEON COMPANY 发明人 BAKER, THOMAS E.;KRASNOW, S. BERT;SILVERMAN, RICHARD A.
分类号 H05K1/02;H05K1/03;H05K3/34;(IPC1-7):H05K1/18 主分类号 H05K1/02
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