Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer

摘要

A curable resinous composition comprising: (A) an organic elastomeric polymer having at least one silicon-containing reactive group in a molecule, (B) an epoxy resin, (C) a silicone compound having a silicon-containing group and a functional group reactive with an epoxy group, and (D) a curing agent for the epoxy resin, wherein said silicon-containing reactive group is a group of the formula: <IMAGE> (I) wherein X is a hydroxyl group or a hydrolyzable group, R1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or an organosiloxy group, "a" is 0, 1, 2, or 3, "b" is 0, 1 or 2 provided that the total of "a" and "b" is at least 1, and "m" is 0 or an integer of 1 to 18, a weight ratio of (A) to (B) being from 1:100 to 100:1 and a weight ratio of (A)+(B) to (C) being from 100:0.1 to 100:20.