| 摘要 |
PURPOSE:To increase the rate of deposition of a plated film and to improve the stability of the film by adding a prescribed amount of a deriv. of dithiocarbamic acid to a plating soln. contg. a copper salt, a complexing agent such as Rochelle salt, a reducing agent, etc. CONSTITUTION:This chemical copper plating soln. is obtd. by adding 0.05-20mg/l deriv. of dithiocarbamic acid combined optionally with 10-100mg/l polyoxyethylene alkyl phenyl ether to a plating soln. contg. a copper salt, a complexing agent, a reducing agent, a pH adjusting agent, and a stabilizer. Rochelle salt or EDTA is used as the complexing agent. |
