| 摘要 |
PURPOSE:To increase the adhesive strength of the surface of an Ni film formed on the surface of a substrate by electroless plating by bringing the Ni film into contact with water having higher purity than ion exchanged water and heated to a specified temp. to activate the film. CONSTITUTION:An Ni film of about 1-30mum thickness is formed on the surface of a substrate of Cu, Al or the like by electroless plating. the surface of the Ni film is brought into contact with water having higher purity than ion exchanged water and heated to <=55 deg.C, preferably 55-70 deg.C for about 1-3min to clean the surface of the film and to bond hydroxyl groups to the surface. The film activated by the bonded hydroxyl groups is dried and a body to be adhered is adhered to the film with an adhesive having an affinity for hydroxyl groups, e.g., a silicone adhesive. |
