PLATING DEVICE FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE:To subject the inside of through-holes of a printed circuit board to plating of uniform thickness of constituting the titled device in such a manner that a plating liquid can be forcibly passed through the through-holes of the printed circuit board. CONSTITUTION:The plating device for the printed circuit board which subjects the printed circuit board 14 to electroplating by impressing a DC voltage thereto while moving the circuit board is constituted of a conveyor 41 which holds and moves the printed circuit board 14 along the moving direction and electrolytic cells 36L, 36R disposed on both sides of the board 14 along the moving direction of the board 14. Ejection holes 38 and recovery holes 40 for the plating liquid are alternately formed on the respective side faces of the cells 36L, 36R which are continuously disposed along the moving direction. These holes are so disposed that the ejection holes 38 and recovery holes 40 of the cells 36L, 36R facing each other face each other with the circuit board 14 in-between.