PLATING DEVICE FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE:To subject the inside of the through-holes of a printed circuit board to plating of uniform thickness by constituting the titled device in such a manner that a plating liquid can be forcibly passed into the thorough-holes of the printed circuit board. CONSTITUTION:The plating device for the printed circuit board which subjects the printed circuit board 14 to electroplating by impressing a DC voltage thereto while moving the circuit board is constituted of a conveyor 41 which holds and moves the printed circuit board 14 along the moving direction and electrolytic cells 36L, 34R disposed on both sides of the board 4 along the moving direction of the board 14. Nozzle holes 40 for the plating liquid for spraying the plating liquid toward the inside of the through-holes of the board 41 are formed to the side faces of the cells 36L, 36R. The nozzle holes 40 on both sides are alternately positioned to the through-holes of the board 14.