| 摘要 |
PURPOSE:To manufacture a lead wire having superior bondability and free from pinholes by plating a pure copper or copper alloy wire with pure gold, drawing the plated wire to a prescribed diameter through dies and carrying out heat treatment and coating with an insulating film. CONSTITUTION:A pure copper wire of 100mum diameter such as an oxygen-free copper or tough pitch copper wire or a copper alloy wire of 100mum diameter such as a Cu-Ag or Cu-Sn wire is plated with pure gold to 2mum thickness. The gold plated copper wire is drawn to 50mum diameter through dies, annealed and coated with urethane resin to form a uniform insulating film. A lead wire having improved bondability owing to the uniform thickness and specular gloss of the gold plating and free from pinholes owing to the uniform urethane resin film is obtd. The lead wire is used for a magnetic head, a micromotor or the like for a high density magnetic storage medium or the like utilized in a computer or the like. |
