| 摘要 |
<p>The invention relates to the cleaning of electronic circuits (6) comprised of electronic components (7, 8, 9), welded according to a known process on to printed circuits carried by a card (10). The injector (1) projects at high pressure a thin liquid curtain (2) which, at its impact on the card (10), is separated into two very thin liquid layers (14 and 15). Said layers pass into the interstices of a few microns which are under the components (7, 8, 9), between those and the card (10). The impurities are expelled from said interstices . Application: removal of waste originating from fabrication and due to the presence of residual impurities under the electronic components (7, 8, 9).</p> |
