| 摘要 |
A plurality n of semiconductor elements Ul to Un are sequentially formed on a substrate side by side and connected in series. The element Ui (where i=1, 2, . . . n) has a first electrode Ei formed on the substrate, a non-single-crystal semiconductor laminate member Qi formed on the electrode Ei and a second electrode Fi formed on the laminate member Qi. The second electrode Fj+l (j=1,2 . . . (n-1) is coupled with the first electrode Ej via a coupling portion Kj formed by an extension of the second electrode Fj+l. A groove Oj is cut in the laminate member Q1 to extend into the first electrode Ej between the second electrode Fj+l and the first electrode Ej. The coupling portion Kj extends in the groove Oj to be coupled with the side surface of the first electrode Ej exposed to the groove Oj. |
