| 摘要 |
PURPOSE:To obtain an economic vessel for an IC by Au-plating only on a necessary portion. CONSTITUTION:A substrate 1 and a conductor metal layer 7 are integrally baked, Ni-flash plated at 8, then selectively Au-flash plated at 9, and pins 12 are eventually Ag-brazed on a mount 6. The pins 12 are not Au-plated in this case. The thickness of the layer 8 of the layer 7 of a wire bonding portion 4 is set to a range of 0.01-0.5mum to prevent Au-plating from swelling at brazing time after Au-plating, and to prevent the conductivity of Au-plating due to diffusion of Ni to Au from deteriorating. With this configuration, the unnecessary use of Au can be reduced to obtain an economic vessel for an IC. |
