Method of branding a semiconductor chip package

摘要

A method for branding (labeling) a semiconductor chip package by warming the package prior to and subsequent to the branding resulting in a brand having greater clarity and permanency. A chip package is warmed to a temperature of about 95 DEG F. (35 DEG C.) to about 130 DEG F. (55 DEG C.) and an inked brand is applied to the warmed chip package. The branded chip package is maintained at a temperature of at least about 75 DEG F. (24 DEG C.) until the temperature is raised to a sufficient temperature to cure the branded chip package and then the branded chip package is cured.