发明名称 |
Ultrasonic detection sensor in hybrid structure with appertaining electronic circuit |
摘要 |
An ultrasonic detection sensor having an integrated structure and formed of a substrate such as used for thick film circuits on which is secured at least one ultrasonic transducer formed of a film packet having n piezo ceramic films and n+1 plastic films. One outermost plastic film layer is secured to the substrate, serving as a backing for the transducer, and a thick film electrical circuit is formed on the same substrate.
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申请公布号 |
US4656384(A) |
申请公布日期 |
1987.04.07 |
申请号 |
US19850788875 |
申请日期 |
1985.10.18 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
MAGORI, VALENTIN |
分类号 |
H04R1/06;B06B1/06;G01B17/00;G01F23/28;G01F23/296;G01S7/52;G01S7/521;H04R17/00;(IPC1-7):H01L41/08 |
主分类号 |
H04R1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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