| 摘要 |
A hybrid circuit device comprising a flat package incorporating an integrated circuit therein, and a delay line circuit constituted by a plurality of coils and a plurality of capacitors. A base plate supporting the delay line circuit is disposed on the flat package. First terminals which are upwardly bent and second terminals are led out of the flat package. The upwardly-bent terminals connect the integrated circuit and delay line circuit to each other at side portions of the base plate. Furthermore, separate external terminals, which are attached to the base plate and connected to the second terminals of the flat package, are provided in two rows holding the flat package therebetween. The device is encapsulated with the free end portion of each of the separate external terminals being exposed through the encapsulation at a position substantially equidistant from the top and bottom surfaces of the encapsulated device.
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