| 摘要 |
<p>PURPOSE:To obtain a resin composition for sealing semiconductor devices, excellent in moldability, and giving a cured product excellent in heat shock resistance and moisture resistance, by mixing an epoxy resin with a phenolic resin curing agent, a cure accelerator, a crushed silica powder and a spherical silica powder at a specified volume ratio. CONSTITUTION:An epoxy resin (A) (e.g., bisphenol A-derived epoxy resin), a phenolic resin curing agent (B), e.g., phenolic novolak resin, a cure accelerator (C), e.g., 2-methylimidazole, crushed silica powder (D) having an average particle diameter of 3-100mum and a spherical silica powder (E) of an average particle diameter of 1-50mum are mixed together so that the amount of component E is 5-90vol% based on the total amount of components D and E, and the total amount of components D and E is 50-75vol% based on the total amount of components A, B, C, D and E to obtain the purpose epoxy resin composition for sealing semiconductor devices.</p> |
