发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE:To reduce irregular stepped sections in a foundation by forming a third conductor electrode connected to a second conductor electrode onto a second smoothing layer and smoothing the surface as the foundation at a time when a photoconductive film is shaped. CONSTITUTION:Second electrodes 30 consisting of a semiconductor such as Al-Si are isolated and formed mutually at every one picture element at regular intervals on a first insulating layer 28 and contact holes 28. The second electrodes 30 are connected electrically to first electrodes 27 through the contact holes 29, a second insulating layer 31 composed of polyimide having low viscosity is shaped from the top sections of the second electrodes 30 to smooth a semiconductor substrate 20, and polyimide is solidified and degassed. Contact holes 32 are formed into the second insulating layer 31, and third electrodes 33 consisting of a semiconductor such as Al-Si are shaped onto the section insulating layer 31 and the contact holes 32 at regular intervals so as to correspond to the second electrodes 30. Accordingly, the smoothness of a foundation at a time when a photoconductive film is laminated is improved.
申请公布号 JPS6273661(A) 申请公布日期 1987.04.04
申请号 JP19850212167 申请日期 1985.09.27
申请人 TOSHIBA CORP 发明人 YANO KENSAKU
分类号 H01L27/146;H04N5/335;H04N5/365;H04N5/369;H04N5/3725;H04N5/3728;H04N5/374 主分类号 H01L27/146
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