| 摘要 |
PURPOSE:To produce an electroless copper plating soln. usable efficiently for a long period by dissolving copper ethylenediaminetetraacetate, formaldehyde, an amino acid and an alkali metallic salt of EDTA in water to prepare a plating soln. and making the soln. alkaline. CONSTITUTION:Copper ethylenediaminetetraacetate as a Cu ion source, formaldehyde as a reducing agent, an amino acid as an auxiliary reducing agent and an alkali metallic salt of EDTA as a complexing agent are dissolved in water as a solvent to prepare a plating soln. and the pH of the soln. is adjusted to about 12-13.5. The concn. of the copper ethylenediaminetetraacetate is about 0.005-0.1M. The Na or K salt of EDTA is used as the alkali metallic salt of EDTA and the concn. is about 1/10-1 time the concn. of the copper salt. Arginine may be used as the amino acid and the concns. of the amino acid and formaldehyde are about 0.01-0.2M each. NaOH or KOH is used for the pH adjustment. Thus, an electroless plating soln. whose pH is hardly lowered in accordance with the progress of plating is obtd. |
