| 摘要 |
The invention relates to the cleaning of electronic circuits 6 constituted by electronic components 7, 8, 9, soldered in a known manner to printed circuits which are carried by a board 10. The injector 1 projects, under high pressure, a thin liquid curtain 2 which, when it impacts the board 10, is split into two very thin liquid layers 14 and 15. These layers pass into the interstices of a few microns which are located beneath the constituents 7, 8, 9, between the latter and the board 10. Impurities are swept out of these interstices. Application: elimination of scrap caused during manufacture by the residual presence of impurities under the electronic constituents 7, 8, 9. <IMAGE>
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