发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent cracks from generating in diode pellets, to enhance the inverse voltage stopping action and to contrive the improvement of the moisture resistance by a method wherein the P-side electrode of the moisture resistance by a method wherein the P-side electrode and N-side electrode of the pellet are formed opposing to each other in the same configuration and embossed protrusion parts in almost the same configuration as the electrodes are connected to the electrodes through solder layers. CONSTITUTION:Embossed protrusion parts 41 and 42 in almost the same configuration as N-side electrodes 37 and 38 or P-side electrodes 39 and 40 of diode pellets 35 and 36 to be installed are provided at pellet mounting parts 33 and 34 of a die-stage 31. The pattern of the electrodes may be a square one A43 or a circular one B'44, for example. These electrodes can be formed by evaporating a metal, such as Au, Ni and V. At the pellet mounting part 33 on one side, for example, the N-side electrode 37 of the diode pellet 35 is installed on the embossed protrusion part 41 through a solder layer 45 and the P-side electrode 39 is installed under the lower surface of an embossed protrusion part 48 of a connector part 47 through a solder layer 46. The peripheral sides of the diode pellet 35 are sealed with an encapsulating resin layer 49.
申请公布号 JPS6272147(A) 申请公布日期 1987.04.02
申请号 JP19850212854 申请日期 1985.09.26
申请人 TOSHIBA CORP 发明人 KUDO YOSHIMASA
分类号 H01L23/29;H01L23/28;H01L23/31;H01L25/07 主分类号 H01L23/29
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