发明名称 COOLING DEVICE FOR SEMICONDUCTOR POWER CONVERTER
摘要 PURPOSE:To contrive a miniaturization of the titled device by a method wherein a chemical heat pump that applies organic chemistry catalytic reaction is arranged midway in a cooling system and the temperature difference between a secondary cooler and the air is made larger. CONSTITUTION:A semiconductor element 1 for power having cooling fins 2 is dipped in such liquid-phase coolant 4 as isopropanol stored in a liquid-phase heat-absorbing reactor 3. This reactor 3 is provided with a first cooler 5, wherein part of evaporated gas is condensed by cooling air (a), on its upper part. A chemical heat pump system is formed with the reactor 3 and a vapor-phase heat-generating reactor 7, wherein a change of the state of vapor-phase coolant 9 is caused, is provided. Moreover, a second cooler 8, which is used for absorbing the heat of gas by cooling air (b), is provided on the upper part of the reactor 7 as well. Furthermore, a heat exchanger 6, by which gas come out of the first cooler 5 is heated with heat inertia and fed in the second cooler 8 and gas come out of the reactor 7 is cooled and returned to the reactor 3, is provided between the reactors 3 and 7. This heat exchanger 6 is heat-insulated from the surroundings and executes the transfer of heat between gases to pass in the mutually opposing directions.
申请公布号 JPS6272150(A) 申请公布日期 1987.04.02
申请号 JP19850211554 申请日期 1985.09.25
申请人 TOSHIBA CORP 发明人 SHINSENJI TOSHIMASA
分类号 H01L23/44;H01L23/427 主分类号 H01L23/44
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