| 摘要 |
PURPOSE:To establish commonality, to enhance integration density, and to reduce work steps by a method wherein it is so arranged along the periphery of a chip that a peripheral block equipped with a plurality of bonding pads is allowed to co-exist with a conventional peripheral block equipped with only one bonding pad. CONSTITUTION:A chip is constituted of two RAMs 1 and 2, two ROMs 3 and 4, a random logic section 5, and peripheral blocks 6-12 positioned along the periphery of the chip. The peripheral blocks 6-12 consist of peripheral blocks 7 and 10 of this invention equipped with a plurality of bonding pads and peripheral blocks 6, 8, 9, 11 and 12 of the conventional design provided with only one bonding pad, arranged to be in co-existence with each other. It may also be so arranged that one of the sides may be occupied by peripheral blocks of the same design. A peripheral block of thin invention is provided with two bonding pads 13 and 14, with a circuit 15 that may be a power source or input/ output circuit positioned between the two pads 13 and 14. |
