| 摘要 |
PURPOSE:To obtain a laser module to be stably used in an extremely wide temperature range by using a metallic material such as solder of which coefficient of thermal expansion is extremely low as compared to an ordinary resin bonding agent at the fixing of respective parts. CONSTITUTION:When the optical axis of parallel laser beams generated by the 1st lens 41 is adjusted so as to coincide with the center axis of the 2nd lens 42 and then current is supplied to the electrodes 102, 103 of a ring-like heater 100, paste solder 101 is heated and instantaneously melted, started to flow like a ring, and after interrupting current supply, instantaneously fixed. The vertical direction to the optical axis is adjusted by the cap 24 and the 3rd supporting body 29, the optical axis direction is adjusted by the 3rd supporting body 39 and the 2nd supporting body 64, and at the maximum projection of the optical fiber, a ring-like protection case 110 and a ring-like heater 120 are successively heated and fixed by current supply. Since the respective parts can be fixed while monitoring optical intensity, a semiconductor laser device 1 characterized by extremely high performance and high reliability is obtained. |
