发明名称 METHOD AND APPARATUS FOR CONVEYING THE SUBSTRATE OF CIRCUIT SUPPORTS
摘要 A method and an apparatus of conveying the substrate of circuit supports, especially in shallow slide grooves or tracks open at the upper side thereof, by means of a slide, said slide first moving the substrate beneath a pressure roller movably positioned above said groove, thereafter jointly moving said substrate and said pressure roll resting on said substrate to the desired locaton within said slide groove, and, upon returning into the original position, moving said pressure roller away from said substrate and into its original position. Said apparatus comprising at least one shallow slide groove or track open at its upper side and serving to receive said substrate, a slide for advancing said substrate and movably positioned within said grooves, and a pressure roller for loading said sliding substrate and being mounted for movement together with said slide.
申请公布号 US3727747(A) 申请公布日期 1973.04.17
申请号 USD3727747 申请日期 1971.12.14
申请人 SCHMALL AUTOMATION UND ELEKTRONIK,DT 发明人 DAMM H,DT
分类号 H01L21/677;H05K13/00;(IPC1-7):B65G25/08;B65H5/04 主分类号 H01L21/677
代理机构 代理人
主权项
地址