Article containing microencapsulated materials

摘要

Articles comprising a thermoplastic substrate bearing rupturable microcapsules in a binder on at least one surface thereof. These articles can be applied by means of heat and pressure to porous objects. The process of applying the articles to porous objects further results in partially embedding the microcapsules in the substrate. Thermoplastic substrates having rupturable microcapsules partially embedded therein, but not having a binder, are another aspect of this invention.