发明名称 |
Apparatus for encapsulating electronic components in plastic material |
摘要 |
Apparatus for encapsulating parts of elements into a plastic material to manufacture electronic components. The mould has one or more parallel rows of mould cavities, into which a plastic material is injected through one or more sprues. The elements are part of a strip of which the length is a multiplicity of the length of a row of cavities, which strip is step by step treated in said mould such that an uninterrupted strip of components is obtained. |
申请公布号 |
US4653993(A) |
申请公布日期 |
1987.03.31 |
申请号 |
US19830523749 |
申请日期 |
1983.08.16 |
申请人 |
BOSCHMAN KLEINPENNING BEHEER B.V. |
发明人 |
BOSCHMAN, EVERARDUS H. |
分类号 |
B29C45/00;B29C45/14;B29C45/46;B29C61/00;H01L21/56;(IPC1-7):B29C45/14;B29C31/04 |
主分类号 |
B29C45/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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