发明名称 Process for determining the plating activity of an electroless plating bath
摘要 A process for monitoring an electroless plating bath to determine whether it is in a take mode by electrolessly depositing a film of the metal of the plating bath onto a substrate to provide a preplated cathode; providing the cathode, a reference electrode, and an anode in the electroless bath; passing an electric current and varying the voltage difference, plotting the voltage difference versus the current; and comparing the oxidation peak of the reducing agent to the oxidation peak of the reduced state of the metal ion to be plated to thereby determine whether the bath is in a take mode.
申请公布号 US4654126(A) 申请公布日期 1987.03.31
申请号 US19850785128 申请日期 1985.10.07
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 AMELIO, WILLIAM J.;MARKOVICH, VOYA;SAMBUCETTI, CARLOS J.;TREVITT, DONNA J.
分类号 C23C18/31;C23C18/16;G01N27/26;G01N27/48;(IPC1-7):G01N27/46 主分类号 C23C18/31
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