Method for producing high resolution etched circuit patterns from clad laminates

摘要

A method for producing high resolution etched circuit patterns from a metal clad laminate of a conductive species on a nonconductive substrate is provided. The laminate is etched with an etchant solution for the conductive species to form a circuit pattern. The etched laminate is contacted with an oxidizing agent and aqueous acid to remove redeposited conductive species from the exposed substrate adjacent the circuit pattern. The side walls of the resulting circuit pattern are substantially vertical and free of "halo".