发明名称 VERFAHREN ZUM HERSTELLEN EINES MIT EINEM VERBINDUNGSNETZWERK VERSEHENEN BAUTEILS UND NACH DEM VERFAHREN HERGESTELLTES BAUTEIL.
摘要 A process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
申请公布号 CH660275(A5) 申请公布日期 1987.03.31
申请号 CH19820002234 申请日期 1982.04.13
申请人 KOLLMORGEN TECHNOLOGIES CORPORATION 发明人 LASSEN, CHARLES L.
分类号 H05K3/10;H01L21/48;H01L23/538;H05K1/11;H05K3/34;H05K7/06 主分类号 H05K3/10
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