| 摘要 |
PURPOSE:To prevent the effect of the warping of a board printed-circuit, by hanging a semiconductor element, which is fixed to the wiring substrate with a protruded electrode, in the part of a through hole, which is provided in the board, filling silicon gel in the through hole, and covering the semiconductor element. CONSTITUTION:A through hole 2 is provided in a printed-circuit board 1. A wiring substrate 5, to which a semiconductor element 3 is fixed with its protruded electrode 4, is made to hang in a space of the hole 2 with a connector wires 6. Then, a flat plate 7 is stuck to the back surface of the board 2 with a bonding material 8. Thereafter, silicon gel 9 is filled in the hole 2 so as to cover the element 3, the wires 6 and the entire body of the substrate 5. A dam for stopping the flow of the gel and a cap (both are not shown in the drawing) are attached. Thus, stress to the element 3 from the board 1 can be alleviated, and the effect of the warping of the board 1 can be prevented. |
