| 摘要 |
PURPOSE:To facilitate resin molding of a chip and avoid degradation of optical characteristics by a method wherein, when the outside of a solid state image pickup device is molded with resin, a cavity is formed between the chip and a light transmitting glass to relieve the stress between the chip and the molding resin. CONSTITUTION:A light transmitting glass 10 is positioned in a cavity 15 of a heated lower die 14 and fixed by vacuum attraction through an evacuating hole 16. A lead frame 30 is turned over by 180 deg. and put on the heated lower die 14 and pressed by a heated upper die 18 and molding resin 20 is cast into the cavity 19 of the upper die 18. Then the softened resin 20 is pressurized by a heated plunger 21 and cast into the cavity 15 of the lower die 14 through gaps 22 around lead wires 13 and die-pads 12 and hardened to form the outside shape. As the gaps around the die-pads are square, the cast resin 20 touches the light transmitting glass 10 with a square shape and air is enclosed between the surface of the chip 1 and the light transmitting glass 10 to form a cavity 23 and a resin molded solid state image pickup device with a cavity is completed. |
