发明名称 LEAD FORMING METHOD
摘要 PURPOSE:To prevent the separation of a lead from a package, by forming the lead without applying a bending stress to the main body of the package when the lead is bent at the root portion thereof. CONSTITUTION:First a lead 5 is bent perpendicularly to the direction of the width of a package 2 by putting dies 6 and 7 on the root portion of the lead, then the fore end of the lead 5 is bent inward, and further the portion bent inward is formed in a curved shape. In the process of forming the lead 5 protecting from the main body 2 of the package, accordingly, the bending thereof in the perpendicular direction at the root portion 5a is conducted before the bending of the fore end portion 5b thereof. Therefore, a lead holding member 6a can be made to contact with the root portion 5a of the lead 5 in this bending process without obstruction by the fore end portion 5b thereof. Thereby the lead 5 can be fixed surely when the lead 5 is bent in the perpendicular direction in which the separation thereof from the package tends to occur most frequency, and thus the separation of the lead 5 from the main body 2 of the package can be prevented effectively.
申请公布号 JPS6269651(A) 申请公布日期 1987.03.30
申请号 JP19850208669 申请日期 1985.09.24
申请人 HITACHI LTD 发明人 TABATA KATSUHIRO;HAGIWARA TAKATOSHI
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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