| 摘要 |
<p>PURPOSE:To enable a semiconductor device to reply to the miniaturization of electronic equipments by reducing the mounting space of semiconductor device for improving the mounting density thereof by a method wherein respective semiconductor devices are connected to both surfaces (surface and backside) of a tape carrier film. CONSTITUTION:Device-connecting electrodes 9 comprising bonding pads are arranged on the surface and backside of a tape carrier film 8; the device- connecting electrodes 9 are electrically connected by bonding process to bump electrodes 11 formed of solder on semiconductor devices 10a, 10b similar to existing flip-chip devices; resultantly the semiconductor devices 10a, 10b are respectively connected to both surfaces of the tape carrier film 8 laid between the devices 10a and 10b. The bump electrodes 11 are formed of solder so that both devices 10a, 10b and the film 8 may be subjected to the least stress in case said devices 10a, 10b are bonded onto the film 8. Finally the ends of substrate connecting leads 12 are electrically connected to the terminal electrodes 15 of circuit substrate 14 by bonding process 13 at the melting point lower than that of the bump electrodes 11.</p> |
